Method and a device for bonding two plate-shaped objects

Details Method and a device for bonding two plate-shaped objects Method and a device for bonding two plate-shaped objects

2007-09-18

2007-09-18

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S106000, C257SE21567

Reexamination Certificate

active

10526191

ABSTRACT:
A method for bonding two plate-shaped objects (5) with an adhesive which is cured by ultraviolet light irradiation and by heating. The two plate-shaped objects (5) with the adhesive in between are transported into a cure chamber (11) comprising an ultraviolet lamp (12) and a heating element (13). A moveable heat-shielding member (3) is temporary present between the objects (5) and the heating element (13) during at least the first part of the irradiation treatment. Preferably, the heat-shielding member (3) is positioned outside the cure chamber (11) during a part of the curve treatment.

REFERENCES:
patent: 6051481 (2000-04-01), Kuiken et al.
patent: 2002/0108707 (2002-08-01), Kobayashi et al.
patent: 2004/0011457 (2004-01-01), Kobayashi et al.
patent: 2004/0149215 (2004-08-01), Shao et al.

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