4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified material other than unalloyed aluminum

Henricus Godefridus Rafael Maas

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Device for bonding two plate-shaped objects

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With means applying wave energy or electrical energy...
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Flexible integrated monolithic circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
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Method and a device for bonding two plate-shaped objects

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
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Method of examining a wafer of semiconductor material by...

X-ray or gamma ray systems or devices – Specific application – Diffraction – reflection – or scattering analysis
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Method of manufacturing a hybrid integrated circuit...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
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Profile ID: LFUS-PAI-P-2451686

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