Metallizing composition for use with ceramics

Compositions – Electrically conductive or emissive compositions – Free metal containing

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252514, 252518, H01B 106

Patent

active

051204738

ABSTRACT:
A metallizing composition for use with ceramics which comprises 100 parts by weight of a CuO-Cu combination consisting of 30 to 70 wt % CuO and 70 to 30 wt % Cu, at least one inorganic component selected from the group consisting of not more than 10 parts by weight of MnO.sub.2, not more than 7 parts by weight of Pt and not more than 5 parts by weight of Au, an organic binder, and a solvent.

REFERENCES:
patent: 4172919 (1979-10-01), Mitchell
patent: 4552691 (1985-11-01), Shoji et al.
patent: 4623482 (1986-11-01), Kuo
patent: 4687597 (1987-08-01), Suita
patent: 4695403 (1987-09-01), Nishimura et al.

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