Metallization structure for altering connections

Details Metallization structure for altering connections Metallization structure for altering connections

1998-04-24

2000-08-15

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Contacts or leads including fusible link means or noise...

257 48, 257723, H01L 2358

Patent

active

061040827

ABSTRACT:
A tailorable metallization level between a first set of pads connected to internal circuits of an electronic structure and a second set of pads for external connection provides for altering the configuration of the electronic structure. The second set of pads is kept invariant to facilitate external connection to the electronic structure. The reconfiguration scheme provides, in one embodiment, for sparing a stacked arrangement of chips. That is, it provides a way to disconnect a defective chip from a stack of chips and connect a spare chip so that, from the point of view of external circuitry, there is no change in the connection to or function of the stack. The invention also provides for changing the logical arrangement of circuits in a single chip, such as the organization of memory I/O.

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