Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1983-12-12
1985-07-02
Smith, John D.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
204192C, 204192N, 427 96, 427259, 427 38, 430318, 430319, H05K 310
Patent
active
045268592
ABSTRACT:
There is disclosed a method of selectively metallizing a ceramic substrate provided with a metallization pattern according by photoresist processing. A first layer of photoresist is blanket deposited over the substrate exposed through a coarse block out mask, and developed in order to protect those areas of the metallization pattern not to be covered with metal. A blanket metal layer is then formed over the entire substrate surface. A second layer of photoresist is deposited, exposed through a customized mask of the metallization pattern, and developed. The exposed metal is etched and the remaining first and second photoresist layers are removed, leaving a coating of metal only at desired locations.
The method may be used for the heavy gold deposition over the Engineering change pads used as a standard in multilayer ceramic substrates.
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IBM Technical Disclosure Bulletin, vol. 20, No. 5, Oct. 1977, "Electroplating Process for Forming Heavy Gold Plating on Multilayer Ceramic Substrates", by D. Loehndorf, p. 1740.
Christensen Richard G.
Moore Robert L.
International Business Machines - Corporation
Powers Henry
Smith John D.
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