Metallization method for microwave circuit

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430311, 430318, 156 89, 156625, 428209, 428901, H05K 302

Patent

active

052503941

ABSTRACT:
The method involves a thick film paste that is screen printed over the circuit plane of the substrate in the desired circuit pattern. The thick film paste is dried and fired. A metallorganic conductive paste is screen printed on top of the thick film circuit pattern, then it is dried and fired. If the printed circuit covers the whole substrate, the metallorganic paste is screen printed over the whole substrate. Alternatively, if the printed circuit covers portions of the substrate, the metallorganic paste is screen printed only over those portions. If the linewidth of the desired circuits is less than 4 mils, then the circuits are defined by photolithography. Alternatively, if the desired linewidth is greater than 4 mils, the screen printing technology is sufficient to define the circuits.

REFERENCES:
patent: 4373019 (1983-02-01), Watanabe
patent: 4748742 (1988-06-01), Choinski
patent: 4835038 (1989-05-01), Kaneko
Rose "Thin Film Circuit Manufacturing Using Thick Film Technology" Hybrid Circuit Technology, Mar. 1990, pp. 48-49.

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