Metallizable substrate composites and printed circuits produced

Details Metallizable substrate composites and printed circuits produced Metallizable substrate composites and printed circuits produced

1987-07-27

1989-01-24

Chin, Peter

Paper making and fiber liberation

Processes and products

With coating after drying

148 6, 148 614R, 162138, 162145, 162152, 1621643, 1621646, 162165, 162166, 1621815, 1621819, D21H 148

Patent

active

047999969

ABSTRACT:
Substrate composites, well adopted for the production of metallized printed circuits and facilely prepared by, e.g., papermaking procedures, include a central core layer comprising fibrous cellulosic material or flaked mica within a matrix of a thermosetting resin binder, said central core element having coextensively laminated to at least one of the face surfaces thereof, a lamina of a thermosetting resin comprising non-conductive metal oxide filler material distributed therethrough, and said metal oxide being borohydride reduceable and reactive to form unstable metal hydride intermediates.

REFERENCES:
patent: 4541894 (1985-09-01), Cassat

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