Metallisation

Details Metallisation Metallisation

2003-06-18

2008-08-12

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S656000, C438S687000, C257SE21295, C257SE21299

Reexamination Certificate

active

07410900

ABSTRACT:
This invention relates to photosensitive organometallic compounds which are used in the production of metal deposits. In particular, this invention relates to photosensitive organometallic compounds such as bis-(perfluoropropyl)-1,5-cyclooctadiene platinum (II) (i.e. (C3F7)2PtC8H12) which on exposure to UV radiation and then a reduction process forms a platinum metal deposit such as a substantially continuous thin ‘sheet-like’ film or a substantially narrow line which is capable of electrical conduction.

REFERENCES:
patent: 4530879 (1985-07-01), Drahnak
patent: 5534312 (1996-07-01), Hill et al.
patent: 6348239 (2002-02-01), Hill et al.
patent: 0 391 314 (1990-10-01), None
patent: 0 493 709 (1992-07-01), None
patent: 2 643 775 (1990-08-01), None
patent: 96 29726 (1996-09-01), None

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