Metallic circuit board and thin film diode array and method of m

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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174256, 174260, 361760, H05K 100

Patent

active

054789710

ABSTRACT:
An object of the invention is to economically and easily manufacture a thin film diode of back-to-back connection type having a symmetric voltage-ampere characteristic. First conducting layers of a metallic circuit board to become a wiring and an island conductor, respectively, are electrically connected with each other via a second conducting layer. The first conducting layers are electrically isolated from each other by anodizing the second conducting layer. An anodized insulating layer is formed by oxidized parts of the first conducting layers and the oxidized second conducting layer. The not-anodized part of one of the first conducting layers becomes a wiring and the not-anodized part of the other of the first conducting layers becomes an island conductor. The island conductor is considered as a first conductor and second and third conductors are formed on the anodized insulating layer on the first conductor. Thereby, a two-terminal element of a back-to-back type is completed.

REFERENCES:
patent: 4800345 (1989-01-01), Podell et al.
patent: 5226841 (1993-07-01), Thorner
patent: 5227663 (1993-07-01), Patil et al.
patent: 5296653 (1994-03-01), Kiyota et al.

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