Metal to metal capacitor apparatus and method for making

Static information storage and retrieval – Systems using particular element – Capacitors

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

365 63, 257296, 257906, G11C11/24

Patent

active

059034939

ABSTRACT:
Embodiments of the invention include a dynamic random access memory (DRAM) and method for making a DRAM in which the capacitive elements are fabricated to be planar or nearly planar and to be located above the metal regions (M1) that connect the sources and drains of the transistor through conductive windows (W1). Embodiments of the invention fabricate the DRAM by forming a transistor on a suitable substrate in the appropriate manner and depositing a first oxide layer that is subsequently planarized by suitable technique. A window is then formed within the oxide layer and a conductive plug is formed within the window. A first patterned metal region, which functions as a memory cell bit line or as a coupler between conductive plugs, is then formed on the oxide layer. A second oxide layer is formed thereon and appropriate windows and conductive plugs are formed therein. Then, a capacitor is formed thereon in a planar or near planar configuration. A second patterned metal region is formed on the capacitor. A third oxide layer is formed thereon and appropriate windows and conductive plugs are formed therein. A third patterned metal region is then formed on the oxide layer. Finally, a fourth oxide layer is deposited and planarized in an appropriate manner. Alternatively, a trench is formed within the second oxide layer around the conductive plug prior to formation of the capacitor thereon. Also, in alternative embodiments, conductive plugs are coupled without the use of patterned metal regions. According to embodiments of the invention, the DRAM fabrication method and the DRAM formed thereby are more conducive than conventional fabrication methods to the use of planarization techniques such as chemical mechanical polishing (CMP). The planar or near planar configuration of the various oxide layers and various DRAM elements formed therein lend themselves well to planarization techniques.

REFERENCES:
patent: 5341324 (1994-08-01), Matsumoto et al.
patent: 5381365 (1995-01-01), Ajika et al.
patent: 5383152 (1995-01-01), Miyake
patent: 5504704 (1996-04-01), Sato et al.
patent: 5519237 (1996-05-01), Itoh et al.
patent: 5604696 (1997-02-01), Takaishi
patent: 5661319 (1997-08-01), Fuji et al.
patent: 5699291 (1997-12-01), Tsunemine
patent: 5701264 (1997-12-01), Shrivastava et al.
patent: 5712813 (1998-01-01), Zhang

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Metal to metal capacitor apparatus and method for making does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal to metal capacitor apparatus and method for making, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal to metal capacitor apparatus and method for making will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-250806

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.