Metal system for semiconductor die attach

Details Metal system for semiconductor die attach Metal system for semiconductor die attach

1990-11-21

1992-04-14

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 357 81, 361381, 361388, H01L 3902, H01L 2302, H01L 2348, H01L 2954

Patent

active

051052580

ABSTRACT:
A layer of aluminum is formed on a surface of a thermal expansion buffer which is used in a semiconductor package. A semiconductor die is attached to the aluminum using a die attach material. An electrical connection for the die is created by attaching a wire from the semiconductor die to the aluminum surface of the buffer. This provides a reliable semiconductor package useful in a high temperature environment.

REFERENCES:
patent: 4650922 (1987-03-01), McPherson
patent: 4680618 (1987-07-01), Kuroda et al.
patent: 4872047 (1989-10-01), Fister et al.
patent: 4946376 (1990-08-01), Sharma et al.
patent: 4965659 (1990-10-01), Sasame et al.

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