Metal stripping composition and process

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

134 3, 156656, 252 793, 252 794, C23F 100

Patent

active

044103964

ABSTRACT:
There is disclosed a chemical stripping solution suitable for removing tin and tin-lead alloys from metallized, e.g. copper coated, substrates so as to leave the said substrate reusable comprising an aqueous solution of hydrogen peroxide in an amount of 0.1 to 10 molar, ammonium bifluoride in an amount of 0.4 to 10 molar, an acid of a type and in an amount such as to maintain the pH of the solution at the surface being stripped below the value at which smut formation occurs whereby effective stripping is achieved in use, and a metal complexing compound in an amount of at least 0.005 molar, the said metal complexing compound comprising 8-hydroxyquinoline or an 8-hydroxyquinoline derivative or a substituted 8-hydroxyquinoline and wherein the molar ratio ammonium bifluoride to complexor is at least 125:1 and the molar ratio of hydrogen peroxide to complexor is at least 50:1.

REFERENCES:
patent: 4306933 (1981-12-01), DaFonte

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