Metal-polymer adhesion by low energy bombardment

Details Metal-polymer adhesion by low energy bombardment Metal-polymer adhesion by low energy bombardment

1988-12-06

1989-12-12

Pianalto, Bernard

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

2041921, 427 35, 427250, B05D 306

Patent

active

048866814

ABSTRACT:
A technique is described for improving metal-organic substrate adhesion and for reducing stress between the metal film and the substrate. Low energy reactive ions, electrons, or photons are incident upon the substrate to alter the surface chemistry of the substrate to a depth of from about 10 angstroms to a few hundred angstroms. The energy of the incident reactive ions and electrons is about 50-2000 eV, while the energy of the incident photons is about 0.2-500 eV. Irradiation of the substrate can occur prior to or during metal deposition. For simultaneous metal deposition/particle irradiation, the arrival rates of the metal atoms and the substrate treatment particles are within a few order of magnitude of one another. Room temperatures or elevated temperatures are suitable.

REFERENCES:
patent: 4165394 (1979-08-01), Ehrbar et al.
patent: 4250225 (1981-02-01), Shirahata et al.
patent: 4560577 (1985-12-01), Mirtich et al.

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