Metal polishing liquid and polishing method using it

Details Metal polishing liquid and polishing method using it Metal polishing liquid and polishing method using it

2006-09-22

2009-06-09

Norton, Nadine (Department: 1792)

Compositions

Heat-exchange, low-freezing or pour point, or high boiling...

Organic components

C252S079100, C252S079200, C252S079300, C252S079400, C216S088000, C134S002000, C134S038000, C438S689000, C438S692000

Reexamination Certificate

active

07544307

ABSTRACT:
A metal polishing liquid which contains a compound represented by the following formula (1), an aromatic heterocyclic ring compound, and an oxidizing agent, and a chemical mechanical polishing method using the metal polishing liquid. In the formula (1), R1denotes an alkylene group, and R2and R3each separately denote a hydrogen atom, a halogen atom, an acyl group, an alkyl group, an alkenyl group, an alkynyl group, or an aryl group.

REFERENCES:
patent: 4116699 (1978-09-01), Rooney
patent: 6604987 (2003-08-01), Sun
patent: 2005/0282387 (2005-12-01), Sato et al.
patent: 2006/0000808 (2006-01-01), Seki et al.
patent: 2006/0110923 (2006-05-01), Liu et al.
patent: 8-083780 (1996-03-01), None
patent: 2001-127019 (2001-05-01), None
patent: 2001-279231 (2001-10-01), None

Affiliated with

Also associated with

Rating

Metal polishing liquid and polishing method using it does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal polishing liquid and polishing method using it, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal polishing liquid and polishing method using it will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4147839