Metal-polishing liquid and polishing method

Details Metal-polishing liquid and polishing method Metal-polishing liquid and polishing method

2008-03-26

2011-12-27

Norton, Nadine G (Department: 1713)

Etching a substrate: processes

Nongaseous phase etching of substrate

Using film of etchant between a stationary surface and a...

C252S079100, C252S079200, C252S079300, C252S079400, C438S689000, C438S690000, C438S691000, C438S692000

Reexamination Certificate

active

08083964

ABSTRACT:
A metal-polishing liquid used for chemical-mechanical polishing of a conductor film of copper or a copper alloy in a process for manufacturing a semiconductor device, the metal-polishing liquid comprising: (1) an amino acid derivative represented by the formula (I); and (2) a surfactant,wherein, in the formula (I), R1represents an alkyl group having 1 to 4 carbon atoms and R2represents an alkylene group having 1 to 4 carbon atoms.

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Byron J. Palla et al. Journal of Colloid and Interface Science, vol. 223, (2000) pp. 102-111.

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