Metal matrix composite and structure using metal matrix composit

Details Metal matrix composite and structure using metal matrix composit Metal matrix composite and structure using metal matrix composit

1987-06-08

1989-02-21

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 685, 75234, H01L 2306

Patent

active

048067040

ABSTRACT:
The invention relates to a metal matrix composite used to support and/or enclose discrete electronic semiconductor devices, monolithic integrated circuits, hybrid circuits, and multi-layer printed wiring boards. The matrices herein disclosed employ aluminum as the matrix with Beta Eucryptite as the additive in a volume percent of up to 60. The preferred range of from 55 to 45 percent by volume of the additive has a coefficient of thermal expansion matching the common semiconductor materials and common ceramics used for electronic enclosures. The composite uses low cost materials, and due to the affinity of the additive to aluminum is easily prepared. The resulting structures have good thermal conductivity and low weight.

REFERENCES:
patent: 4105456 (1978-08-01), Murakami et al.
J. H. Fishwick Application of Lithium in Ceramics Cahners Pub. Co., Boston, 1974 pp. 23-47.
Beta-Eucryptite Technical Data Bulletin 321, Foote Mineral Co., Exton, PA.

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