Metal interconnection of a semiconductor device and method...

Details Metal interconnection of a semiconductor device and method... Metal interconnection of a semiconductor device and method...

2005-11-07

2010-06-29

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S619000, C438S620000, C438S621000, C438S623000, C438S622000, C257S783000, C257S295000, C257S700000, C257S774000, C257S773000, C257S037000, C257S292000, C257S310000

Reexamination Certificate

active

07745323

ABSTRACT:
Disclosed herein is a metal interconnection structure of a semiconductor device, comprising lower metal interconnection layers disposed on a semiconductor substrate, a buffer layer made of a metal oxide disposed thereon, an intermetallic dielectric layer made of a low-k material disposed on the buffer layer of the metal oxide, and an upper metal interconnection layer disposed on the intermetallic dielectric layer and electrically connected through the intermetallic dielectric layer and buffer layer to the lower metal interconnection layers.

REFERENCES:
patent: 5089442 (1992-02-01), Olmer
patent: 5332694 (1994-07-01), Suzuki
patent: 5416048 (1995-05-01), Blalock et al.
patent: 5482900 (1996-01-01), Yang
patent: 5503882 (1996-04-01), Dawson
patent: 5560802 (1996-10-01), Chisholm
patent: 5563104 (1996-10-01), Jang et al.
patent: 5607773 (1997-03-01), Ahlburn et al.
patent: 5612574 (1997-03-01), Summerfelt et al.
patent: 5619393 (1997-04-01), Summerfelt et al.
patent: 5627403 (1997-05-01), Bacchetta et al.
patent: 5679606 (1997-10-01), Wang et al.
patent: 5716890 (1998-02-01), Yao
patent: 5798298 (1998-08-01), Yang et al.
patent: 5808363 (1998-09-01), Watanabe
patent: 5814564 (1998-09-01), Yao et al.
patent: 5821162 (1998-10-01), Yamaha et al.
patent: 5861332 (1999-01-01), Yu et al.
patent: 5861345 (1999-01-01), Chou et al.
patent: 5905298 (1999-05-01), Watatani
patent: 5913140 (1999-06-01), Roche et al.
patent: 5915200 (1999-06-01), Tokumasu et al.
patent: 5932487 (1999-08-01), Lou et al.
patent: 5940734 (1999-08-01), Inoue
patent: 5946592 (1999-08-01), Lin
patent: 5960321 (1999-09-01), Hsieh et al.
patent: 5969409 (1999-10-01), Lin
patent: 5999379 (1999-12-01), Hsiao et al.
patent: 6004873 (1999-12-01), Jang et al.
patent: 6020265 (2000-02-01), Lou
patent: 6060382 (2000-05-01), Lee
patent: 6083850 (2000-07-01), Shields
patent: 6093634 (2000-07-01), Chen et al.
patent: 6093637 (2000-07-01), Kishimoto et al.
patent: 6103586 (2000-08-01), Chetlur et al.
patent: 6136685 (2000-10-01), Narwankar et al.
patent: 6144060 (2000-11-01), Park et al.
patent: 6159842 (2000-12-01), Chang et al.
patent: 6171945 (2001-01-01), Mandal et al.
patent: 6187683 (2001-02-01), De Santi et al.
patent: 6191050 (2001-02-01), Andideh
patent: 6232225 (2001-05-01), Pong et al.
patent: 6239034 (2001-05-01), Yang et al.
patent: 6261883 (2001-07-01), Koubuchi et al.
patent: 6261942 (2001-07-01), Zhou et al.
patent: 6284588 (2001-09-01), Yu
patent: 6291848 (2001-09-01), Chetlur et al.
patent: 6319848 (2001-11-01), Litwin et al.
patent: 6320213 (2001-11-01), Kirlin et al.
patent: 6329717 (2001-12-01), Jang et al.
patent: 6337282 (2002-01-01), Kim et al.
patent: 6365015 (2002-04-01), Shan et al.
patent: 6372664 (2002-04-01), Jang et al.
patent: 6376394 (2002-04-01), Tsai et al.
patent: 6407780 (2002-06-01), Sung
patent: 6426285 (2002-07-01), Chen et al.
patent: 6451666 (2002-09-01), Hong et al.
patent: 6511923 (2003-01-01), Wang et al.
patent: 6562668 (2003-05-01), Jang et al.
patent: 6573194 (2003-06-01), Brankner et al.
patent: 6627462 (2003-09-01), Yang et al.
patent: 6709971 (2004-03-01), Kozhukh et al.
patent: 6727184 (2004-04-01), Wang et al.
patent: 6734488 (2004-05-01), Aihara et al.
patent: 6740531 (2004-05-01), Cho et al.
patent: 6770556 (2004-08-01), Yau et al.
patent: 6781216 (2004-08-01), Nakamura
patent: 6841396 (2005-01-01), Celii et al.
patent: 6911397 (2005-06-01), Jun et al.
patent: 6940171 (2005-09-01), Hill
patent: 6943091 (2005-09-01), Yu et al.
patent: 6972451 (2005-12-01), Delpech et al.
patent: 6974985 (2005-12-01), Kurasawa et al.
patent: 6982444 (2006-01-01), Kanaya et al.
patent: 7002256 (2006-02-01), Nakamura
patent: 7023037 (2006-04-01), Cho et al.
patent: 7042034 (2006-05-01), Hong
patent: 7141503 (2006-11-01), Naughton et al.
patent: 7262136 (2007-08-01), Polinsky et al.
patent: 7288443 (2007-10-01), Zhu, Huilong
patent: 7517750 (2009-04-01), Choi et al.
patent: 2001/0027004 (2001-10-01), Park et al.
patent: 2001/0035706 (2001-11-01), Raina et al.
patent: 2002/0011645 (2002-01-01), Bertin et al.
patent: 2002/0100959 (2002-08-01), Joo et al.
patent: 2002/0155661 (2002-10-01), Massingill et al.
patent: 2002/0155694 (2002-10-01), Park
patent: 2002/0187630 (2002-12-01), Zedlitz et al.
patent: 2003/0113992 (2003-06-01), Yau et al.
patent: 2003/0143862 (2003-07-01), Iyer
patent: 2004/0183116 (2004-09-01), Cho et al.
patent: 2005/0127829 (2005-06-01), Takahashi
patent: 2005/0136683 (2005-06-01), Lee et al.
patent: 2005/0263767 (2005-12-01), Yamazaki et al.
patent: 2005/0266676 (2005-12-01), Hill
patent: 2006/0017168 (2006-01-01), Lee
patent: 2006/0068553 (2006-03-01), Thean et al.
patent: 2006/0125102 (2006-06-01), Wu et al.
patent: 2006/0264017 (2006-11-01), Miyagawa
patent: 2007/0012906 (2007-01-01), Kim et al.
patent: 2007/0049004 (2007-03-01), Smythe
patent: 1999-57281 (1999-07-01), None
patent: 2001-65232 (2001-07-01), None

Affiliated with

Also associated with

Rating

Metal interconnection of a semiconductor device and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Metal interconnection of a semiconductor device and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Metal interconnection of a semiconductor device and method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4150391