Metal gate compatible flash memory gate stack

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S314000, C257S316000, C257S288000, C257S266000, C438S211000, C438S257000, C438S264000

Reexamination Certificate

active

07834387

ABSTRACT:
A first gate stack comprising two stacked gate electrodes in a first device region, a second gate stack comprising a metal gate electrode in a second device region, and a third gate stack comprising a semiconductor gate electrode in a third device region are formed by forming and removing portions of a silicon-oxide based gate dielectric layer, a first doped semiconductor layer, an interfacial dielectric layer, a high-k gate dielectric layer, a metal gate layer, and an optional semiconductor material layer in various device regions. The first gate stack may be employed to form a flash memory, and the second and third gate stacks may be employed to form a pair of p-type and n-type field effect transistors.

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