Metal foil for printed wiring board and production thereof

Details Metal foil for printed wiring board and production thereof Metal foil for printed wiring board and production thereof

1993-05-12

1995-04-04

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428612, 428675, 428687, 428935, B32B 1520, B32B 330

Patent

active

054036720

ABSTRACT:
A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

REFERENCES:
patent: 3857683 (1974-12-01), Castonguay
patent: 3998601 (1976-12-01), Yates et al.
patent: 4088544 (1978-05-01), Hotkin
patent: 4503112 (1985-03-01), Konicek
patent: 4888574 (1989-12-01), Rice et al.
patent: 4935310 (1990-06-01), Nakatsugawa
patent: 5262247 (1993-11-01), Kajiwara et al.

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