Metal foil for printed wiring board and production thereof

Details Metal foil for printed wiring board and production thereof Metal foil for printed wiring board and production thereof

1994-12-16

1997-11-25

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

156629, 156630, 427 96, 437183, H05K 302

Patent

active

056898797

ABSTRACT:
A metal foil for printed wiring boards comprising a first copper layer to be adhered to a resin, a second copper layer having a sufficient strength as a metal layer and a nickel-phosphorus alloy layer containing 1.1% by weight or more of phosphorus formed between the first and second copper layers is suitable for producing printed wiring boards having excellent heat resistance, particularly during production procedures.

REFERENCES:
patent: 4394419 (1983-07-01), Konicek
patent: 4503112 (1985-03-01), Konicek
patent: 4503131 (1985-03-01), Bavdrand
patent: 4642161 (1987-02-01), Akahoshi et al.
patent: 4717591 (1988-01-01), Acosta et al.
patent: 4735694 (1988-04-01), Kukanskis
patent: 4970107 (1990-11-01), Akahoshi et al.
patent: 5038795 (1991-08-01), Brewer et al.

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