Metal etch stop fabrication method and structure

Details Metal etch stop fabrication method and structure Metal etch stop fabrication method and structure

2011-04-12

2011-04-12

Lee, Jinhee J (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S250000, C174S261000, C361S813000, C257S551000, C257S178000, C257S774000, C438S106000, C438S200000, C438S253000, C029S832000, C029S846000

Reexamination Certificate

active

07923645

ABSTRACT:
A first patterned etch stop layer and a first patterned conductor layer are laminated by a dielectric material to a second patterned etch stop layer and a second patterned conductor layer. As the etch stop metal of the first and second patterned etch stop layers is selectively etchable compared to a conductor metal of the first and second patterned conductor layers, the first and second patterned etch stop layers provide an etch stop for substrate formation etch processes. In this manner, etching of the first and second patterned conductor layers is avoided insuring that impedance is controlled to within tight tolerance.

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