Metal etch solution and method

Details Metal etch solution and method Metal etch solution and method

1981-03-23

1982-08-24

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 156664, 156666, 252 793, 252 794, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

043459692

ABSTRACT:
A solution is disclosed for the one-step etching of a three layer titanium-nickel-copper metallization. The etch solution comprises about 1.8 to 2.0 moles/liter hydrofluoric acid, about 2.5 to 4.0 moles/liter acetic acid, about 8.7 to 9.0 moles/liter nitric acid, and balance water. Use of the solution permits the patterned etching of sequential layers of titanium, nickel, and copper without excessive attack of underlying silicon dioxide layers.

REFERENCES:
patent: 2981609 (1961-04-01), Acker et al.
patent: 3960741 (1976-06-01), Gabrail
patent: 4220706 (1980-09-01), Spak

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