Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1981-12-10
1983-07-26
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156666, 252 792, C23F 100, B44C 122, C03C 1500, C03C 2506
Patent
active
043953026
ABSTRACT:
An improved process for dissolution of metals by etching, and particularly the etching of copper in printed circuit board processing or the like, using an aqueous H.sub.2 O.sub.2 --H.sub.2 SO.sub.4 etching solution, in which the concentration of H.sub.2 SO.sub.4 in the etching solution is allowed to decrease during use of the etching solution from an initial, relatively high level at the time the etching solution is put into use, to a final, relatively low level. When a predetermined concentration of dissolved etched metal exists in the etching solution, the etching solution is removed from use, H.sub.2 SO.sub.4 is added to increase the concentration of H.sub.2 SO.sub.4 in the etching solution to approximately the initial, relatively high level, and the metal is precipitated out of the etching solution.
REFERENCES:
patent: 3400027 (1968-09-01), Radimer et al.
Circuit World (GB), vol. 6, No. 1, 1979, Hydrogen Peroxide/Sulphuric Acid Etching Systems by D. C. Simpkins, pp. 54-57.
Enthone Incorporated
Powell William A.
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