Metal contacts and interconnections for VLSI devices

Details Metal contacts and interconnections for VLSI devices Metal contacts and interconnections for VLSI devices

1987-08-13

1989-06-27

James, Andrew J.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

357 65, 357 68, 427305, H01L 2348, B05D 304

Patent

active

048434531

ABSTRACT:
Metal contacts and interconnections for integrated circuits utilize copper as the primary conductor, with the copper being totally encased in refractory metal layers on both top and bottom surfaces and also sidewalls. The contact hole in silicon oxide may be filled with a plug of refractory metal before the copper is deposited, or the first refractory metal layer may be conformally deposited to coat the sidewalls of the hole.

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patent: 4720908 (1988-01-01), Wills

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