Metal contact LGA socket

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...

Reexamination Certificate

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Reexamination Certificate

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06945788

ABSTRACT:
A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic molded over a central section of the contact. The molded inserts are receivable in the apertures of the substrate and are later swaged to retain them and the contacts to the substrate.

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patent: 5395252 (1995-03-01), White
patent: 5427535 (1995-06-01), Sinclair
patent: 5462440 (1995-10-01), Rothenberger
patent: 5498166 (1996-03-01), Rothenberger
patent: 5653598 (1997-08-01), Grabbe
patent: 5893761 (1999-04-01), Longueville
patent: 6146151 (2000-11-01), Li
patent: 6186797 (2001-02-01), Wang et al.
patent: 6247938 (2001-06-01), Rathburn
patent: 6315576 (2001-11-01), Neidich
patent: 6375474 (2002-04-01), Harper, Jr. et al.
patent: 6442045 (2002-08-01), Goodwin et al.
patent: 6699047 (2004-03-01), McHugh et al.

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