Metal ball attachment of heat dissipation devices

Details Metal ball attachment of heat dissipation devices Metal ball attachment of heat dissipation devices

2006-01-31

2006-01-31

Thompson, Gregory (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S016300, C165S080200, C165S080300, C165S185000, C257S707000, C257S713000, C301S064600, C301S064600, C301S064600

Reexamination Certificate

active

06992891

ABSTRACT:
An assembly including a heat dissipation device having an attachment surface, a substrate having an attachment surface, and a plurality of metal balls extending between the heat dissipation device attachment surface and the substrate attachment surface. The assembly may include at least one microelectronic die disposed between the heat dissipation device attachment surface and the substrate attachment surface.

REFERENCES:
patent: 6469381 (2002-10-01), Houle et al.
patent: 6507104 (2003-01-01), Ho et al.
patent: 6525420 (2003-02-01), Zuo et al.

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