Metal and electronically conductive polymer transfer

Details Metal and electronically conductive polymer transfer Metal and electronically conductive polymer transfer

2005-09-15

2008-08-12

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C257SE21499

Reexamination Certificate

active

07410825

ABSTRACT:
The invention relates to a donor laminate comprising in order, a substrate, an electronically conductive polymer layer in contact with said substrate, and a metal layer.

REFERENCES:
patent: 4070189 (1978-01-01), Kelley et al.
patent: 4731408 (1988-03-01), Jasne
patent: 4987042 (1991-01-01), Jonas et al.
patent: 5093439 (1992-03-01), Epstein et al.
patent: 5171650 (1992-12-01), Ellis et al.
patent: 5294560 (1994-03-01), Ono et al.
patent: 5300575 (1994-04-01), Jonas et al.
patent: 5312681 (1994-05-01), Muys et al.
patent: 5354613 (1994-10-01), Quintens et al.
patent: 5370981 (1994-12-01), Krafft et al.
patent: 5372924 (1994-12-01), Quintens et al.
patent: 5391472 (1995-02-01), Muys et al.
patent: 5403467 (1995-04-01), Jonas et al.
patent: 5443944 (1995-08-01), Krafft et al.
patent: 5520849 (1996-05-01), Eiffler
patent: 5561030 (1996-10-01), Holdcroft et al.
patent: 5575898 (1996-11-01), Wolf et al.
patent: 5665498 (1997-09-01), Savage et al.
patent: 5674654 (1997-10-01), Zumbulyadis et al.
patent: 5716550 (1998-02-01), Gardner et al.
patent: 5738934 (1998-04-01), Jones
patent: 5828432 (1998-10-01), Shashidhar et al.
patent: 5976274 (1999-11-01), Inoue et al.
patent: 5976284 (1999-11-01), Calvert et al.
patent: 6045977 (2000-04-01), Chandross et al.
patent: 6096491 (2000-08-01), Majumdar et al.
patent: 6114088 (2000-09-01), Wolk et al.
patent: 6124083 (2000-09-01), Majumdar et al.
patent: 6140009 (2000-10-01), Wolk et al.
patent: 6190846 (2001-02-01), Majumdar et al.
patent: 6214520 (2001-04-01), Wolk et al.
patent: 6221553 (2001-04-01), Wolk et al.
patent: 6404120 (2002-06-01), Aben et al.
patent: 6582876 (2003-06-01), Wolk et al.
patent: 6586153 (2003-07-01), Wolk et al.
patent: 6639637 (2003-10-01), Stephenson
patent: 6707517 (2004-03-01), Stephenson
patent: 6849869 (2005-02-01), O'Regan et al.
patent: 2002/0197554 (2002-12-01), Wolk et al.
patent: 2003/0008135 (2003-01-01), Kawamura et al.
patent: 2003/0157425 (2003-08-01), Kawase
patent: 2004/0065970 (2004-04-01), Blanchet-Fincher
patent: 2004/0108047 (2004-06-01), Afzali-Ardakani et al.
patent: 2004/0214037 (2004-10-01), Roberts et al.
patent: 2005/0037235 (2005-02-01), Nishio et al.
patent: 0 440 957 (1996-03-01), None
patent: 0 615 256 (1998-09-01), None
patent: 1 079 397 (2001-02-01), None
patent: 0 686 662 (2002-11-01), None
patent: 1 054 414 (2003-03-01), None
patent: 1 524 678 (2005-04-01), None
patent: WO 97/18944 (1997-05-01), None
patent: WO 00/39835 (2000-07-01), None
Research Disclosure No. 41548, Nov. 1998, p. 1473, Kenneth Mason Publications Ltd., Hampshire, England.
U.S. Appl. No. 10/969,889 filed Oct. 21, 2004, Gates et al.
U.S. Appl. No. 11/022,155 filed Dec. 22, 2004, Majumdar et al.
Jin-Woo Park et al., “Polyimide as a Plastic Substrate for the Flexible Organic Electroluminescent Device” Mat. Res. Soc. Symp. Proc., vol. 814, 2004, pp. 139-144.

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