MERIE plasma reactor with overhead RF electrode tuned to the...

Electric heating – Metal heating – By arc

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C219S121430, C219S121570, C118S7230IR

Reexamination Certificate

active

11105307

ABSTRACT:
A plasma reactor for processing a semiconductor workpiece, includes a reactor chamber having a chamber wall and containing a workpiece support for holding the semiconductor support, the electrode comprising a portion of the chamber wall, an RF power generator for supplying power at a frequency of the generator to the overhead electrode and capable of maintaining a plasma within the chamber at a desired plasma ion density level. The overhead electrode has a capacitance such that the overhead electrode and the plasma formed in the chamber at the desired plasma ion density resonate together at an electrode-plasma resonant frequency, the frequency of the generator being at least near the electrode-plasma resonant frequency. The reactor further includes a set of MERIE magnets surrounding the plasma process area overlying the wafer surface that produce a slowly circulating magnetic field which stirs the plasma to improve plasma ion density distribution uniformity.

REFERENCES:
patent: 2951960 (1960-09-01), Watrous, Jr.
patent: 2967926 (1961-01-01), Edstrom
patent: 3355615 (1967-11-01), Le Bihan et al.
patent: 3610986 (1971-10-01), King
patent: 4458180 (1984-07-01), Sohval
patent: 4464223 (1984-08-01), Gorin
patent: 4570106 (1986-02-01), Sohval
patent: 4579618 (1986-04-01), Celestino et al.
patent: 4859908 (1989-08-01), Yoshida et al.
patent: 4888518 (1989-12-01), Grunwald
patent: 4973883 (1990-11-01), Hirose et al.
patent: 4990229 (1991-02-01), Campbell et al.
patent: 5006760 (1991-04-01), Drake, Jr.
patent: 5017835 (1991-05-01), Oechsner
patent: 5032202 (1991-07-01), Tsai et al.
patent: 5053678 (1991-10-01), Koike et al.
patent: 5055853 (1991-10-01), Garnier
patent: 5077499 (1991-12-01), Oku
patent: 5089083 (1992-02-01), Kojima et al.
patent: 5107170 (1992-04-01), Ishikawa et al.
patent: 5115167 (1992-05-01), Ootera et al.
patent: 5122251 (1992-06-01), Campbell et al.
patent: 5140223 (1992-08-01), Gesche et al.
patent: 5175472 (1992-12-01), Johnson et al.
patent: 5195045 (1993-03-01), Keane et al.
patent: 5198725 (1993-03-01), Chen et al.
patent: 5210466 (1993-05-01), Collins et al.
patent: 5213658 (1993-05-01), Ishida
patent: 5218271 (1993-06-01), Egorov et al.
patent: 5223457 (1993-06-01), Mintz et al.
patent: 5225024 (1993-07-01), Hanley et al.
patent: 5246532 (1993-09-01), Ishida
patent: 5256931 (1993-10-01), Bernadet
patent: 5272417 (1993-12-01), Ohmi
patent: 5273610 (1993-12-01), Thomas, III et al.
patent: 5274306 (1993-12-01), Kaufman et al.
patent: 5279669 (1994-01-01), Lee
patent: 5280219 (1994-01-01), Ghanbari
patent: 5300460 (1994-04-01), Collins et al.
patent: 5314603 (1994-05-01), Sugiyama et al.
patent: 5325019 (1994-06-01), Miller et al.
patent: 5401351 (1995-03-01), Samukawa
patent: 5432315 (1995-07-01), Kaji et al.
patent: 5453305 (1995-09-01), Lee
patent: 5463525 (1995-10-01), Barnes et al.
patent: 5467013 (1995-11-01), Williams et al.
patent: 5474648 (1995-12-01), Patrick et al.
patent: 5512130 (1996-04-01), Barna et al.
patent: 5534070 (1996-07-01), Okamura et al.
patent: 5537004 (1996-07-01), Imahashi et al.
patent: 5554223 (1996-09-01), Imahashi
patent: 5556549 (1996-09-01), Patrick et al.
patent: 5567268 (1996-10-01), Kadomura
patent: 5576600 (1996-11-01), McCrary et al.
patent: 5576629 (1996-11-01), Turner et al.
patent: 5587038 (1996-12-01), Cecchi et al.
patent: 5592055 (1997-01-01), Capacci et al.
patent: 5595627 (1997-01-01), Inazawa et al.
patent: 5605637 (1997-02-01), Shan et al.
patent: 5618382 (1997-04-01), Mintz et al.
patent: 5627435 (1997-05-01), Jansen et al.
patent: 5660671 (1997-08-01), Harada et al.
patent: 5662770 (1997-09-01), Donohoe
patent: 5674321 (1997-10-01), Pu et al.
patent: 5685914 (1997-11-01), Hills et al.
patent: 5705019 (1998-01-01), Yamada et al.
patent: 5707486 (1998-01-01), Collins
patent: 5710486 (1998-01-01), Ye et al.
patent: 5720826 (1998-02-01), Hayashi et al.
patent: 5733511 (1998-03-01), De Francesco
patent: 5770922 (1998-06-01), Gerrish et al.
patent: 5792376 (1998-08-01), Kanai et al.
patent: 5846885 (1998-12-01), Kamata et al.
patent: 5849136 (1998-12-01), Mintz et al.
patent: 5849372 (1998-12-01), Annaratone et al.
patent: 5855685 (1999-01-01), Tobe et al.
patent: 5858819 (1999-01-01), Miyasaka
patent: 5863376 (1999-01-01), Wicker et al.
patent: 5866986 (1999-02-01), Pennington
patent: 5868848 (1999-02-01), Tsukamoto
patent: 5885358 (1999-03-01), Maydan et al.
patent: 5904799 (1999-05-01), Donohoe
patent: 5914568 (1999-06-01), Nonaka
patent: 5929717 (1999-07-01), Richardson et al.
patent: 5936481 (1999-08-01), Fiji
patent: 5939886 (1999-08-01), Turner et al.
patent: 5942074 (1999-08-01), Lenz et al.
patent: 5971591 (1999-10-01), Vona et al.
patent: 5997962 (1999-12-01), Ogasawara et al.
patent: 6016131 (2000-01-01), Sato et al.
patent: 6043608 (2000-03-01), Samukawa et al.
patent: 6089182 (2000-07-01), Hama
patent: 6093457 (2000-07-01), Okumura et al.
patent: 6095084 (2000-08-01), Shamouilian et al.
patent: 6096160 (2000-08-01), Kadomura
patent: 6106663 (2000-08-01), Kuthi et al.
patent: 6110395 (2000-08-01), Gibson, Jr.
patent: 6113731 (2000-09-01), Shan et al.
patent: 6142096 (2000-11-01), Sakai et al.
patent: 6152071 (2000-11-01), Akiyama et al.
patent: 6155200 (2000-12-01), Horijke et al.
patent: 6162709 (2000-12-01), Raoux et al.
patent: 6174450 (2001-01-01), Patrick et al.
patent: 6188564 (2001-02-01), Hao
patent: 6213050 (2001-04-01), Liu et al.
patent: 6218312 (2001-04-01), Collins et al.
patent: 6245190 (2001-06-01), Masuda et al.
patent: 6251216 (2001-06-01), Okamura et al.
patent: 6262538 (2001-07-01), Keller
patent: 6290806 (2001-09-01), Donohoe
patent: 6291999 (2001-09-01), Nishimori et al.
patent: 6337292 (2002-01-01), Kim et al.
patent: 6346915 (2002-02-01), Okumura et al.
patent: RE37580 (2002-03-01), Barnes et al.
patent: 6449568 (2002-09-01), Gerrish
patent: 6451703 (2002-09-01), Liu et al.
patent: 6462481 (2002-10-01), Holland et al.
patent: 6528751 (2003-03-01), Hoffman et al.
patent: 6586886 (2003-07-01), Katz et al.
patent: 6652712 (2003-11-01), Wang et al.
patent: 6894245 (2005-05-01), Hoffman et al.
patent: 2002/0139477 (2002-10-01), Ni et al.
patent: 2003/0132195 (2003-07-01), Edamura et al.
patent: 2003/0168427 (2003-09-01), Flamm et al.
patent: 0 343 500 (1989-11-01), None
patent: 0 678 903 (1995-10-01), None
patent: 0 719 447 (1998-07-01), None
patent: WO 01/71765 (2001-09-01), None
King, Ronald W.P., “Transmission-Line Theory”, Dover Publications, Inc., 1965, New York, pp. 1-10 and 282-286.
U.S. Appl. No. 10/007,367, filed Oct. 22, 2001, entitled “Merie Plasma Reactor with Overhead RF Electrode Tuned to the Plasma with Arcing Suppression”, by Daniel Hoffman, et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

MERIE plasma reactor with overhead RF electrode tuned to the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with MERIE plasma reactor with overhead RF electrode tuned to the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and MERIE plasma reactor with overhead RF electrode tuned to the... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3727839

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.