Merging sub-resolution assist features of a...

Computer-aided design and analysis of circuits and semiconductor – Design of semiconductor mask or reticle – Yield

Reexamination Certificate

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Details

C716S050000, C716S053000, C716S055000

Reexamination Certificate

active

08056029

ABSTRACT:
Merging sub-resolution assist features includes receiving a mask pattern that includes the sub-resolution assist features. A first sub-resolution assist feature is selected to merge with a second sub-resolution assist feature. A merge bar width of a merge bar is established. A distance between the first sub-resolution assist feature and the second sub-resolution assist feature is determined. A merging technique is determined in accordance with the distance and the merge bar width. The first sub-resolution assist feature and the second sub-resolution assist feature are merged according to the identified merging technique.

REFERENCES:
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