Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen
Reexamination Certificate
2008-05-06
2008-05-06
Williams, Hezron (Department: 2856)
Measuring and testing
Specimen stress or strain, or testing by stress or strain...
By loading of specimen
C073S204230
Reexamination Certificate
active
11196849
ABSTRACT:
A micromachined sensor for measuring vascular parameters, such as fluid shear stress, includes a substrate having a front-side surface, and a backside surface opposite the front-side surface. The sensor includes a diaphragm overlying a cavity etched within the substrate, and a heat sensing element disposed on the front-side surface of the substrate and on top of the cavity and the diaphragm. The heat sensing element is electrically couplable to electrode leads formed on the backside surface of the substrate. The sensor includes an electronic system connected to the backside surface and configured to measure a change in heat convection from the sensing element to surrounding fluid when the sensing element is heated by applying an electric current thereto, and further configured to derive from the change in heat convection vascular parameters such as the shear stress of fluid flowing past the sensing element.
REFERENCES:
patent: 5242863 (1993-09-01), Xiang-Zheng et al.
patent: 5291781 (1994-03-01), Nagata et al.
patent: 5883310 (1999-03-01), Ho et al.
patent: 6044705 (2000-04-01), Neukermans et al.
patent: 6071819 (2000-06-01), Tai et al.
patent: 6341532 (2002-01-01), Xu et al.
patent: 6408698 (2002-06-01), Brereton et al.
patent: 6825539 (2004-11-01), Tai et al.
patent: 6852216 (2005-02-01), Moscaritolo et al.
patent: 6855249 (2005-02-01), Moscaritolo
patent: 6877385 (2005-04-01), Fang et al.
patent: 6901794 (2005-06-01), Zobel et al.
patent: 2004/0093932 (2004-05-01), Hajduk et al.
patent: 2006/0107752 (2006-05-01), Kotovsky
Liu et al. “A Micromachined Flow Shear-Stress Sensor Based on Thermal Transfer Principles,” Mar. 1999, IEEE, Journal of Microelectromechanical Systems, vol. 8, No. 1, pp. 90-99.
Pan et al. “Microfabricated Shear Stress Sensors, Part 1: Design and Fabrication,” Jan. 1999, AIAA Journal, vol. 37, No. 1, pp. 66-69.
Rouhnizadeh, M., G. Soundararajan, D. Ascara, R. Lo, F. Browand, T.K. Hsiai, MEMS sensors to resolve spatial variations in shear stress in a 3-D blood vessel bifurcation model.IEEE Sensors Journal, vol. 6, No. 10: pp. 78-88 (Feb. 2006).
Soundararajan, G., M. Rouhanizadeh, H. Yu, L. DeMaio, E.S. Kim and T.K. Hsiai, MEMS Shear Stress Sensors for Microcirculation, InSensors and Actuators A: Physical, ISSN: 0924-4247 vol. 118, No. 1: pp. 25-32 (2005).
Soundararajan, G., Hsiai, T. Microsensors to Characterize Shear Stress Regulating MCP-1 Expression in Vessel Bifurcations, San Francisco, 2004, 2 pp.
Soundararajan, G., M. Rouhanizadeh, L. DeMaio, and T.K. Hsiai, MEMS Shear stress sensors for cardiovascular diagnostics, InProceedings of the 26th Annual International Conference of the IEEE EMBS, San Francisco, CA, USA, Sep. 1-5, 2004, pp. 2420-2423 (2004).
Soundararajan, G., M. Rouhinizadeh, H. Yu, E.S. Kim, and T.K. Hsiai, Micro Sensors to Detect Shear Stress On Vascular Cells, 11th Foresight Conference on Molecular Nanotechnology, San Francisco, 2003. Abstract only.
Rouhanizadeh, M., L. DeMaio, D. Ascara, T. Hsiai, Spatial Variations in Shear Stress at Low Reynolds numbers.Annals of Biomedical Engineering, vol. 33, No. 10: 1360-1374 (Oct. 2005).
Hsiai Tzung K.
Kim E. S.
Lin Tiantian
Rouhanizadeh Mahsa
Soundararajan Gopkrishnani
Fitzgerald John
McDermott Will & Emery LLP
University of Southern California
Williams Hezron
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