MEMS package and packaging method thereof

Details MEMS package and packaging method thereof MEMS package and packaging method thereof

2007-07-25

2011-10-11

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S417000, C257S418000, C257S419000, C257S420000, C257SE29324, C438S050000, C438S052000, C438S053000

Reexamination Certificate

active

08035176

ABSTRACT:
Provided are a Micro Electro-Mechanical System (MEMS) package and a method of packaging the MEMS package. The MEMS package includes: a MEMS device including MEMS structures formed on a substrate, first pad electrodes driving the MEMS structures, first sealing parts formed at an edge of the substrate, and connectors formed on the first pad electrodes and the first sealing parts; and a MEMS driving electronic device including second pad electrodes and second sealing parts respectively corresponding to the first pad electrodes and the first sealing parts to be sealed with and bonded to the MEMS device through the connectors to form an air gap having a predetermined width.

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