MEMS microphone package and method thereof

Details MEMS microphone package and method thereof MEMS microphone package and method thereof

2007-11-21

2010-11-09

Smith, Bradley K (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S687000, C257SE23116, C438S127000

Reexamination Certificate

active

07829961

ABSTRACT:
A MEMS microphone package includes a carrier, an application specific IC, an encapsulant and a microphone chip. The application specific IC and the microphone chip are respectively disposed on first and second surfaces of the carrier, and the application specific IC and the microphone chip are electrically connected to the carrier. The encapsulant includes first and second encapsulants, the first encapsulant is formed on the first surface to seal the application specific IC, the second encapsulant is formed on the second surface to become a cavity and the microphone chip is located at the cavity. Because the application specific IC and the microphone chip are disposed on the first and second surfaces of the carrier, respectively, the second encapsulant surrounds the microphone chip, and the first and second encapsulants are formed at the same time, it can increase the structural strength of package and reduce the process.

REFERENCES:
patent: 2007/0205492 (2007-09-01), Wang
patent: 2007/0222008 (2007-09-01), Chen et al.

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