MEMS fabrication on a laminated substrate

Wave transmission lines and networks – Long line elements and components – Switch

Reexamination Certificate

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C333S156000, C343S876000

Reexamination Certificate

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07084724

ABSTRACT:
Systems and methods are provided that facilitate the formation of micro-mechanical structures and related systems on a laminated substrate. More particularly, a micro-mechanical device and a three-dimensional multiple frequency antenna are provided for in which the micro-mechanical device and antenna, as well as additional components, can be fabricated together concurrently on the same laminated substrate. The fabrication process includes a low temperature deposition process allowing for deposition of an insulator material at a temperature below the maximum operating temperature of the laminated substrate, as well as a planarization process allowing for the molding and planarizing of a polymer layer to be used as a form for a micro-mechanical device.

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Cetiner et al.,Microwave Laminate PCB Compatible RF MEMS Technology for Wireless Communication Systems, Antennas and Propagation Society International Symposium, 2003. IEEE, Published Jun. 2003, vol. 1, pp. 387-390.
Cetiner, et al.,Monolithic Integration of RF MEMS Switches with a Diversity Antenna on PCB Substrate, IEEE Transactions on Microwave Theory and Techniques, vol. 15, No. 1, Jan. 2003, pp. 332-335.
Chang et al.,RF MEMS Switches Fabricated on Microwave-Laminate Printed Circuit Boards, IEEE Electron Device Letters, vol. 24, No. 4, Apr. 2003, pp. 227-229.

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