MEMS device wafer-level package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

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C257S704000, C257SE23124, C257SE23127

Reexamination Certificate

active

07466018

ABSTRACT:
A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.

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