Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2007-02-06
2007-02-06
Smith, Zandra V. (Department: 2822)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S782000, C438S787000
Reexamination Certificate
active
10895477
ABSTRACT:
A method of depositing polymer thin films on a MEMS device having a wafer stack includes depositing one or more protection films on a polymer thin film layer on the wafer stack, fabricating the MEMS device, and removing the one or more protection films.
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patent: 2005/0280106 (2005-12-01), Kim
Groh Mike
Liao Hang
Mellander Timothy
Barnes Seth
Hewlett--Packard Development Company, L.P.
Smith Zandra V.
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