MEMS device packaging methods

Details MEMS device packaging methods MEMS device packaging methods

2005-11-22

2009-02-17

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S048000, C438S106000, C257S415000, C257S416000, C257S417000, C257S414000, C257SE27122

Reexamination Certificate

active

07491567

ABSTRACT:
A method of packaging a MEMS device that includes, for example, the steps of providing a MEMS die that has a MEMS device, a seal ring and bond pads disposed thereon, providing a MEMS package that has a recess, a seal ring and bond pads disposed thereon, positioning the MEMS die over the MEMS package to align the seal rings and bond pads, inserting the MEMS die and MEMS package into a vacuum chamber and evacuating gasses therefrom to form a controlled vacuum pressure therein, sealing the MEMS package and the MEMS die together at the seal rings to form a package having a hermitically sealed interior chamber and simultaneously forming electrical connections between the corresponding bond pads.

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Correspondence from Singapore Patent Office mailed Jan. 14, 2008.

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