MEMS device having a trilayered beam and related methods

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation

Reexamination Certificate

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C200S512000

Reexamination Certificate

active

06876047

ABSTRACT:
MEMS Device Having A Trilayered Beam And Related Methods. According to one embodiment, a movable, trilayered microcomponent suspended over a substrate is provided and includes a first electrically conductive layer patterned to define a movable electrode. The first metal layer is separated from the substrate by a gap. The microcomponent further includes a dielectric layer formed on the first metal layer and having an end fixed with respect to the substrate. Furthermore, the microcomponent includes a second electrically conductive layer formed on the dielectric layer and patterned to define an electrode interconnect for electrically communicating with the movable electrode.

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“Bottom Contact Micromechanical Switching Geometry,” IBM Technical Disclosure Bulletin, vol. 21, No. 3, pp. 1207-1208, Aug. 1978.

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