MEMS apparatus and method of manufacturing the same

Details MEMS apparatus and method of manufacturing the same MEMS apparatus and method of manufacturing the same

2011-03-15

2011-03-15

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S418000, C257SE29324, C438S051000, C438S052000

Reexamination Certificate

active

07906823

ABSTRACT:
A MEMS apparatus includes a MEMS unit formed on a semiconductor substrate and a cover provided with a pore and serving to seal the MEMS unit. The pore is sealed with a sealing material shaped in a sphere or a hemisphere.

REFERENCES:
patent: 7344907 (2008-03-01), Colgan et al.
patent: 2006/0108675 (2006-05-01), Colgan et al.
patent: 2007/0099395 (2007-05-01), Sridhar et al.
patent: 2008/0296717 (2008-12-01), Beroz et al.
patent: 2009/0289349 (2009-11-01), Novotny et al.
patent: 10-163505 (1998-06-01), None
patent: 2004-042248 (2004-02-01), None
Decharat, et al., Novel Room-Temperature Wafer-to-Wafer Attachment and Sealing of Cavities Using Cold Metal Welding, MEMS, 2007.

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