Memory modules and systems including the same

Details Memory modules and systems including the same Memory modules and systems including the same

2011-06-28

2011-06-28

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S685000, C257S730000, C257S777000

Reexamination Certificate

active

07968994

ABSTRACT:
Provided is a memory module. The memory module may include a mounting substrate including a plurality of first substrate pads disposed on a top surface of the mounting substrate, a first semiconductor package disposed on a top surface of the mounting substrate, the first semiconductor package having a first frame and first external connection terminals which extend through the outside of the first frame and are disposed on the first substrate pads, a first connection member including first connection terminals disposed between the first external connection terminals and the first substrate pads and a pressure fixing member compressing the first connection member to electrically connect the first external connection terminals and the first substrate pads by the medium of the first connection terminals.

REFERENCES:
patent: 6737738 (2004-05-01), Koh et al.
patent: 2006/0102997 (2006-05-01), Bang et al.
patent: 2006148105 (2006-06-01), None
patent: 1020060053834 (2006-05-01), None
patent: 100712540 (2007-04-01), None
patent: 1020070081009 (2007-08-01), None

Affiliated with

Also associated with

Rating

Memory modules and systems including the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Memory modules and systems including the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Memory modules and systems including the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2676259