Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-11-04
2009-11-10
Pham, Long (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C029S025000, C029S041000, C029S042000, C361S311000, C361S312000, C361S313000
Reexamination Certificate
active
07615869
ABSTRACT:
Embodiments are described in which a stacked arrangement of integrated circuit packages comprises a dummy substrate comprising an embedded discrete or distributed capacitor connected to first and/or second power voltages, or an embedded termination register connected to one or more clock, control, address, and/or data signals(s).
REFERENCES:
patent: 5656856 (1997-08-01), Kweon
patent: 5744827 (1998-04-01), Jeong et al.
patent: 6480409 (2002-11-01), Park et al.
patent: 6642614 (2003-11-01), Chen
patent: 6791192 (2004-09-01), Lin et al.
patent: 6809421 (2004-10-01), Hayaska et al.
patent: 6873031 (2005-03-01), McFadden et al.
patent: 0336359 (1989-10-01), None
patent: 0340527 (1989-11-01), None
patent: 0582315 (1994-02-01), None
patent: 61006846 (1986-01-01), None
patent: 11168157 (1999-06-01), None
patent: 2003142624 (2003-05-01), None
patent: 2003197809 (2003-07-01), None
patent: 2004214509 (2004-07-01), None
patent: 101995028068 (1997-05-01), None
patent: 9724740 (1997-07-01), None
Peter, R., Ultra-low profile chip scale package challenges for 300mm die bonder, Business Briefing: Global Semiconductor Manufacturing, 2003, 1-5, www.touchbriefing.com.
Koo Chang-Woo
Park Young-Jun
So Byung-Se
Pham Long
Rao Steven H
Samsung Electronics Co,. Ltd.
Volentine & Whitt PLLC
LandOfFree
Memory module with stacked semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Memory module with stacked semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Memory module with stacked semiconductor devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4094076