Memory module with improved mechanical strength of chips

Details Memory module with improved mechanical strength of chips Memory module with improved mechanical strength of chips

2006-05-09

2009-12-29

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S109000, C438S108000, C438S111000, C438S113000, C438S118000, C257S686000, C257S778000, C257S737000

Reexamination Certificate

active

07638362

ABSTRACT:
A memory module of the present invention has a memory core chip for storing information, an interface chip for controlling data input/output, an interposer chip for transmitting/receiving data to/from the outside, and an external connection terminal provided in closest proximity to the interposer chip. A heat dissipating plate is provided in closest proximity to the interface chip. The interposer chip has a substrate made of a semiconductor material that is similar to the memory core chip, a land for holding the external connection terminal, a wire connected to the external connection terminal, and an insulating film for insulating the wire. The land, wire, and insulating film are integrally formed on one surface of the interposer chip.

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