Semiconductor device and method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S259000, C438S587000, C438S296000, C438S593000, C438S792000, C257SE29129, C257SE29309, C257SE21625, C257SE21422

Reexamination Certificate

active

07598562

ABSTRACT:
A semiconductor device including a semiconductor substrate; an element isolation region having a trench filled with an insulating film defined on the semiconductor substrate; a memory cell transistor formed in an element forming region isolated by the element isolating regions of the semiconductor substrate; and the memory cell transistor includes a gate insulating film formed on a surface of the element forming region; a floating gate formed over the gate insulating film; an inter-gate insulating film formed integrally so as to cover the floating gate and the insulating film of the element isolation region and having high dielectric constant in a portion corresponding to the floating gate and low dielectric constant in a portion corresponding to the insulating film of the element isolation region; and a control gate stacked over the floating gate via the inter-gate insulating film.

REFERENCES:
patent: 5422291 (1995-06-01), Clementi et al.
patent: 5498560 (1996-03-01), Sharma et al.
patent: 5621233 (1997-04-01), Sharma et al.
patent: 5847427 (1998-12-01), Hagiwara
patent: 6121087 (2000-09-01), Mann et al.
patent: 6395654 (2002-05-01), Yang et al.
patent: 6525369 (2003-02-01), Wu
patent: 2001/0024857 (2001-09-01), Parat et al.
patent: 2002/0135013 (2002-09-01), Chiu
patent: 2002/0160570 (2002-10-01), Tseng
patent: 2003/0183869 (2003-10-01), Crivelli et al.
patent: 2003/0193064 (2003-10-01), Wu
patent: 2004/0004265 (2004-01-01), Lee et al.
patent: 2005/0218442 (2005-10-01), Hieda
patent: 2006/0205155 (2006-09-01), Makabe et al.
patent: 2006/0220093 (2006-10-01), Van Schaijk et al.
patent: 2006/0240619 (2006-10-01), Ozawa et al.
patent: 2006/0246665 (2006-11-01), Crivelli et al.
patent: 2007/0202646 (2007-08-01), Tseng
patent: 2008/0067576 (2008-03-01), Yaegashi
patent: 2008/0197400 (2008-08-01), Aritome
patent: 571692 (1993-12-01), None
patent: 8-17945 (1996-01-01), None
patent: 2000-100976 (2000-04-01), None
patent: 2001-15616 (2001-01-01), None
patent: 2004-319586 (2004-11-01), None
patent: 2005-026590 (2005-01-01), None
S. F. Ting, et al., “The Effect of Remote Plasma Nitridation on the Integrity of the Ultrathin Gate Dielectric Films in 0.13 μm CMOS Technology and Beyond,” IEEE Electron Device Letters, vol. 22, No. 7, Jul. 2001, pp. 327-329.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4139734

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.