Memory module having memory chips protected from excessive heat

Details Memory module having memory chips protected from excessive heat Memory module having memory chips protected from excessive heat

2008-01-08

2008-01-08

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23080, C361S720000, C361S721000

Reexamination Certificate

active

07317248

ABSTRACT:
The invention relates to a memory module having a printed circuit board; having one or more memory chips which are arranged in a first region of the printed circuit board and are contact-connected by the printed circuit board; having a buffer chip for driving the memory chips and for communicating with a system that is external to the memory module, the buffer chip being arranged in a second region of the printed circuit board and being contact-connected by the printed circuit board; wherein the first and second regions of the printed circuit board are essentially thermally decoupled from one another.

REFERENCES:
patent: 6205028 (2001-03-01), Matsumura
patent: 6787895 (2004-09-01), Jarcy et al.
patent: 6940164 (2005-09-01), Yoshimatsu et al.
patent: 7031164 (2006-04-01), Yamaguchi
patent: 7124931 (2006-10-01), Lewis et al.
patent: 2003/0107462 (2003-06-01), Cho
patent: 2004/0012934 (2004-01-01), Jafari et al.
patent: 2005/0018405 (2005-01-01), Kawano et al.
patent: 2005/0035447 (2005-02-01), Basho et al.
patent: 41 21 545 (1993-01-01), None
German Patent Office Examination Report dated Jun. 13, 2005.

Affiliated with

Also associated with

Rating

Memory module having memory chips protected from excessive heat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Memory module having memory chips protected from excessive heat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Memory module having memory chips protected from excessive heat will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2751966