Memory module

Details Memory module Memory module

2006-10-10

2006-10-10

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S685000, C257S686000, C257S678000, C257S724000

Reexamination Certificate

active

07119436

ABSTRACT:
The memory module includes a plurality of memory units, each of which include a memory substrate, at least a memory chip having a predetermined memory capacity mounted on the memory substrate, and a conductive terminal provided at a lower edge portion of the memory substrate to electrically connect with the memory chip. An assembling arrangement includes a first joint provided at a side edge of each of the memory substrates and a second joint provided at an opposed side edge of each of the memory substrates, wherein the first joint of the memory unit is detachably engaged with the second joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner, such that the memory units form the memory module.

REFERENCES:
patent: 5497027 (1996-03-01), Crafts
patent: 6911730 (2005-06-01), New
patent: 2001/0053565 (2001-12-01), Khoury
patent: 3-105953 (1991-05-01), None

Affiliated with

Also associated with

Rating

Memory module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Memory module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Memory module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3712751