Memory masking for periphery salicidation of active regions

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257369, 257754, 257296, H01L 2978, H01L 2945

Patent

active

060518642

ABSTRACT:
An integrated circuit memory fabrication process and structure, in which salicidation is performed on the periphery (and optionally on the ground lines) of a memory chip, but not on the transistors of the memory cells.

REFERENCES:
patent: 4253907 (1981-03-01), Parry et al.
patent: 4384938 (1983-05-01), Desilets et al.
patent: 4543271 (1985-09-01), Peters
patent: 4654112 (1987-03-01), Douglas et al.
patent: 4657628 (1987-04-01), Holloway et al.
patent: 4686000 (1987-08-01), Heath
patent: 4707218 (1987-11-01), Giammarco et al.
patent: 4721548 (1988-01-01), Morimoto
patent: 4755476 (1988-07-01), Bohm et al.
patent: 4801560 (1989-01-01), Wood et al.
patent: 4810666 (1989-03-01), Taji
patent: 4824767 (1989-04-01), Chambers et al.
patent: 4894351 (1990-01-01), Batty
patent: 4986878 (1991-01-01), Malazgirt et al.
patent: 4988423 (1991-01-01), Yamamoto et al.
patent: 5003062 (1991-03-01), Yen
patent: 5010032 (1991-04-01), Tang et al.
patent: 5030585 (1991-07-01), Gonzalez et al.
patent: 5061646 (1991-10-01), Sivan et al.
patent: 5063176 (1991-11-01), Lee et al.
patent: 5072275 (1991-12-01), Vora
patent: 5110763 (1992-05-01), Matsumoto
patent: 5166088 (1992-11-01), Ueda et al.
patent: 5244841 (1993-09-01), Marks et al.
patent: 5250472 (1993-10-01), Chen et al.
patent: 5266525 (1993-11-01), Morozumi
patent: 5286674 (1994-02-01), Roth et al.
patent: 5310720 (1994-05-01), Shin et al.
patent: 5320983 (1994-06-01), Ouellet
patent: 5321211 (1994-06-01), Haslam et al.
patent: 5380553 (1995-01-01), Loboda
patent: 5411917 (1995-05-01), Forouhi et al.
patent: 5478772 (1995-12-01), Fazan
"A Novel Borderless Contact/Interconnect Technology Using Aluminum Oxide Etch Stop for High Performance SRAM and Logic," Proceedings of the International Electron Devices Meeting, Washington, D.C. Dec. 5-8, 1993, Institute of Electrical and Electronics Engineers, pp. 441-444.
"Etching--Applications and Trends of Dry Etching," Handbook of Advanced Technology and Computer Systems at 27ff, 1988, pp. 27-72.
"Doped Silicon Oxide Deposition by Atmospheric Pressure and Low Temperature Chemical Vapor Deposition Using Tetraethoxysilane and Ozone," Journal of Electrochemical Society, Oct. 1991, pp. 3019-3024.
"Hot-Carrier Aging of the MOS Transistor in the Presence of Spin-on Glass as the Interlevel Dielectric," EEE Electron Device Letters, vol. 12, No. 3, Mar. 1991, pp. 140-142.
"The Effect of Plasma Cure Temperature on Spin-on Glass," J. Electrochem. Soc., vol. 140, No. 4, Apr. 1993, pp. 1121-1125.
"Three `Low DT` Options for Planarizing the Pre-metal Dielectric on an Advanced Double Poly BiCMOS Process," J. Electrochem. Soc., vol. 139, No. 2, Feb. 1992, pp. 532-536.
"Polysilicon Planarization Using Spin-on Glass," J. Electrochem. Soc., vol. 139, No. 2, Feb. 1992, pp. 591-599.
"Plasma Etch Anisotropy--Theory and Some Verifying Experiments Relating Ion Transport, Ion Energy, and Etch Profiles," J. Electrochem. Soc.: Solid State Science and Technology, May 1993, pp. 1144-1152.
"Advantages of Using Spin-on-Glass Layer in Interconnection Dielectic Planarization," Microelectronic Engineering, Dec. 1986, Nos. 1-4, pp. 413-421.
"Method for Reducing the Diffusion Contact Borders," IBM Technical Disclosure Bulletin, Sep. 1989, vol. 32, No. 4A, pp. 344-345.
"Silicon processing for the VLSI era," Vol. 2: Process Integration, 1990, pp. 273-275.
"VLSI Fabrication Principles," S.K. Ghandi, Wiley & Sons, pp. 479-482 and 499-501.
"VLSI Electronics Microstructure Science," Plasma Processing for VLSI: vol. 8, 1984, pp. 298-339.
Device Physics (A Handbook of Semiconductors, vol. 4), 1981, pp. 208-209.
"Dual Self-Aligned Silicides on FET Gates and Junctions," IBM Technical Disclosure Bulletin, vol. 31, No. 7, p. 154, Dec. 1988.
"Separation of Gate Salicidation from the Source/Drain Salicidation," IBM Technical Disclosure Bulletin, vol. 34, No. 10A, pp. 474-477, Mar. 1992.

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