Memory heat sink device provided with a larger heat...

Details Memory heat sink device provided with a larger heat... Memory heat sink device provided with a larger heat...

2011-03-22

2011-03-22

Vortman, Anatoly (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S702000, C361S707000, C361S709000, C361S715000, C361S679540, C257S709000, C257S719000

Reexamination Certificate

active

07911798

ABSTRACT:
A memory heat sink device having an enlarged heat dissipating area is provided. The memory heat sink device includes two cooling fins that are respectively attached to a front side and a back side of a memory. Raised dots are protruded from a front (or back) side of the cooling fin attached to the front (or back) side of the memory. Each of the raised dots on the cooling fin has at least one sectional area and at least one connection portion. Thus, the heat sink area of the cooling fin increases and heat generated by the memory is easily dissipated by the sectional area through thermal convection.

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