Substrate processing apparatus

Details Substrate processing apparatus Substrate processing apparatus

2011-08-16

2011-08-16

MacArthur, Sylvia R. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C134S198000, C134S186000

Reexamination Certificate

active

07998306

ABSTRACT:
The present invention provides a substrate processing apparatus for processing substrates by immersing the substrates in a processing liquid. This substrate processing apparatus includes a processing tank having a pair of side walls arranged to be opposed to each other; and a pair of processing-liquid supply mechanisms provided respectively corresponding to the pair of side walls. The pair of processing-liquid supply mechanisms are respectively configured for supplying the processing liquid toward a central portion of the processing tank in the width direction connecting the pair of side walls, thereby to create a rising flow of the processing liquid in a central area in the width direction of the processing tank. Each inner wall face of the pair of side walls includes a main body, a projecting portion located above the main body, and a discharge guide portion located uppermost and providing a discharge port configured for allowing the processing liquid to overflow. The discharge guide portion is inclined upward, opposite to the central portion in the width direction. The projecting portion includes an inner end portion located nearer to the central portion in the width direction, as compared with the main body and discharge guide portion.

REFERENCES:
patent: 4995411 (1991-02-01), Lowell et al.
patent: 5845663 (1998-12-01), Han
patent: 2009/0139656 (2009-06-01), Hiroshiro et al.
patent: 2006-179758 (2006-07-01), None
Abiko et al .Machine Generated English Translation of JP2006-179758. Jul. 6, 2006.

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