Memory cell design with vertically stacked crossovers

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

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257368, 257758, 257776, 257903, 257904, 365 69, 365154, 365180, 36518507, H01L 2976, H01L 2994, H01L 31062, H01L 31113

Patent

active

057341877

ABSTRACT:
A memory cell with vertically stacked crossovers. In prior memory cells, crossover connections within the memory cell were implemented in the same device layer. This wasted valuable design space, since the crossovers were therefore required to sit side-by-side in the layout design. The present invention implements crossovers in different materials on different device layers. The crossovers may therefore be vertically stacked on top of each other, reducing the area of the memory cell.

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