Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2000-12-23
2002-08-27
Wilson, Allan R. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S773000, C257S784000
Reexamination Certificate
active
06441502
ABSTRACT:
BACKGROUND OF THE INVENTION
(1) Field of the Invention
The present invention relates to a member for mounting of semiconductor used for producing a resin-sealed semiconductor device and a method for producing thereof.
(2) Description of the Prior Art
Heretofore, a member for mounting of semiconductor is known in which a substrate
102
is provided with a plurality of concave portions
103
for electrode terminal as shown in
FIG. 17A
, and electrode terminals
104
are formed in the concave portions
103
. The production of a resin-sealed semiconductor device made by using the above-mentioned member
101
for mounting of semiconductor is usually carried out as follows. First, a semiconductor device
111
is mounted on a central flat area
102
a
of a substrate
102
in which electrode terminals
104
are not formed, and electrode pads
112
of the semiconductor device
111
and the electrode terminals
101
of the member
101
for mounting of semiconductor are electrically connected with each other through bonding wires
115
. Then, the semiconductor device
111
, the electrode terminals
104
and the bonding wires
115
are coated with resin part
117
, and thereafter the substrate
102
of the member
101
for mounting of semiconductor is peeled off from the resin-sealed semiconductor device, which can be obtained (refer to FIG.
17
B).
Such a member for mounting of semiconductor is produced by forming concave portions for electrode terminal in a substrate by the etching process and plating the inside of the concave portions to form electrode terminals. Namely, photosensitive resist is applied on a substrate, the photosensitive resist is exposed to light through a mask for forming of concave portions, the exposed photosensitive resist is developed to form a resist pattern. Then, the substrate is half-cut to form concave portions by etching the substrate through the resist pattern as a mask. Thereafter, the substrate is plated through the same resist pattern as a mask to form electrode terminals inside the concave portions
However, since in recent years, the number of I/O was increased because of semiconductor device being made highly functional and because of the inside of semiconductor and buss being made high frequency, it became necessary to use ground in common by wiring around a member for mounting of semiconductor.
Heretofore, in order to meet such a necessity, after electrode terminals were formed in concave portions as above-mentioned, further a resist pattern for wire was formed on a substrate of a member for mounting of semiconductor, and the substrate was plated through the resist pattern for wire.
FIG. 18A
is a view showing an example of such a member for mounting of semiconductor. A member
101
′ for mounting of semiconductor is provided with a wire
106
which is needed to use ground, power and others in common, on a central flat area
102
a
of a substrate
102
in which electrode terminals
104
are not formed. In this member
101
′ for mounting of semiconductor, a semiconductor device
111
is mounted on the central flat area
102
a
in which the electrode terminals
104
and the wire
106
are not formed, thereafter electrode pads
112
of the semiconductor device
111
and the electrode terminals
104
and wire
106
of the member for mounting of semiconductor
101
′ are electrically connected with each other (FIG.
18
B).
However, to produce the above-mentioned member
101
′ for mounting of semiconductor provided with wire
106
, in the producing process thereof, two resist pattern-forming processes for forming of a resist pattern used for forming of concave portions
103
and for forming of a resist pattern used for forming of wire
106
are needed. Further, forming, matching of the shape of the second resist pattern formed in the second resist pattern-forming process with that of the first resist pattern formed in the first resist pattern-forming process is needed. Therefore, there is a problem that the producing process takes long time and is complicated. Further, since the above-mentioned matching is needed, arrangement of wire and electrode terminals is depends on the accuracy of the above-mentioned matching. Therefore, there is a limit in drawing fine wire. Such a problem results a hindrance to the reduction in the production cost of resin-sealed semiconductor device.
SUMMARY OF THE INVENTION
Therefore, considering the above-mentioned prior state, it is an object of the present invention to provide a member for mounting of semiconductor used for producing resin-sealed semiconductor device having a small size, high density, and high functionality, and a method for easily producing the member for mounting of semiconductor.
In order to achieve this object, a member for mounting of semiconductor according to the present invention comprises a substrate, concave portions for electrode and a concave portion for wire which are provided on one surface of the substrate, electrode terminals formed in the concave portions for electrode and a wire formed in the concave portion for wire, wherein the concave portions for electrode are formed deeper more than the concave portion for wire.
Further, in a member for mounting of semiconductor according to the present invention, a concave portion for mounting of semiconductor device is formed inside the concave portion for wire and a conductive layer is provided in the concave portion for mounting of semiconductor device.
A method for producing a member for mounting of semiconductor according to the present invention comprises the steps of: forming of resist pattern wherein a resist pattern is formed on one surface of a substrate, the resist pattern including openings for electrode for forming concave portions for electrode and opening for wire for forming concave portion for wire, wherein the width of the openings for electrode is larger than the width of the opening for wire; etching of the substrate wherein the substrate is half-cut by etching the substrate through the resist pattern as a mask so that concave portions for electrode and concave portion for wire are formed on one surface of the substrate; plating the substrate through the resist pattern as a mask so that electrode terminals are formed in the concave portions for electrode and wire is formed in the concave portions for wire and; thereafter peeling off the resist pattern from the substrate.
Further, In a method for producing a member for mounting of semiconductor, in the above-mentioned step of forming of resist pattern, the resist pattern which further includes an opening for mounting of semiconductor device inside an opening for wire is formed, in the etching process, the substrate is half-cut to form a concave portion for mounting a semiconductor device and in the plating step, conductive layer is formed on the concave portion for mounting of semiconductor device.
REFERENCES:
patent: 5214308 (1993-05-01), Nishiguchi et al.
patent: 6111311 (2000-08-01), Suzuki
patent: 6172423 (2001-01-01), Lee
patent: 11031756 (1999-02-01), None
Sato Hideki
Shimazaki Yo
Tsubosaki Kunihiro
Yamada Jun-ichi
Dainippon Printing Co., Ltd.
Flynn ,Thiel, Boutell & Tanis, P.C.
Wilson Allan R.
LandOfFree
Member for mounting of semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Member for mounting of semiconductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Member for mounting of semiconductor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2939162