Mechanically joined sputtering target and adapter therefor

Details Mechanically joined sputtering target and adapter therefor Mechanically joined sputtering target and adapter therefor

1996-06-21

1998-04-14

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

C23C 1434

Patent

active

057387702

ABSTRACT:
A target assembly in which the sputtering material is not soldered or otherwise metallurgically bonded to a backing plate. Rather, the target, which is homogeneously manufactured of sputtering material, is mechanically coupled (e.g., with bolts) to an adapter, which is itself permanently affixed to the chamber. As a result, the target can be easily uncoupled from the chamber and replaced, without also requiring removal and replacement of a backing plate.

REFERENCES:
patent: 4820397 (1989-04-01), Fielder
patent: 4855033 (1989-08-01), Hurwitt
patent: 5009765 (1991-04-01), Qamar et al.
patent: 5066381 (1991-11-01), Ohta et al.
patent: 5143590 (1992-09-01), Strothers et al.
patent: 5147521 (1992-09-01), Belli et al.
patent: 5259941 (1993-11-01), Munz
patent: 5269403 (1993-12-01), Pouliquen et al.
patent: 5529673 (1996-06-01), Strauss et al.
Tokyo Electron KK, "Sputtering Device Has Readily Replaceable Target" English Abstract, Japanese Document 2-285069.
Murata Seisakusho KK, "Target For Sputtering" English Abstract, Japanese Document 55-89471.

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